As AI and high‑performance computing (HPC) workloads strain traditional air‑cooled data centers, Sabey Data Centers is expanding its partnership with JetCool Technologies to make direct‑to‑chip liquid cooling a standard option across its U.S. portfolio. The move signals how multi‑tenant operators are shifting from experimental deployments to programmatic strategies for high‑density, energy‑efficient infrastructure.

Sabey, one of the largest privately held multi‑tenant data center providers in the United States, first teamed with JetCool in 2023 to test direct‑to‑chip cooling in production environments. Those early deployments reported 13.5% server power savings compared with air‑cooled alternatives, while supporting dense AI and HPC racks without heavy reliance on traditional mechanical systems.

The new phase of the collaboration is less about proving the technology and more about scale. Sabey and JetCool are now working to simplify how customers adopt liquid cooling by turning what had been bespoke engineering work into repeatable designs that can be deployed across multiple sites. The goal is to give enterprises and cloud platforms a predictable path to high‑density infrastructure that balances performance, efficiency and operational risk.

A core element of that approach is a set of modular cooling architectures developed with Dell Technologies for select PowerEdge GPU‑based servers. By closely integrating server hardware and direct‑to‑chip liquid cooling, the partners aim to deliver pre‑validated building blocks for AI and HPC clusters, rather than starting from scratch with each project. The design includes unified warranty coverage for both the servers and the cooling system, an assurance that Sabey says is key for customers wary of fragmented support models.

The expanded alliance sits inside Sabey’s broader liquid cooling partnership program, an initiative that aggregates multiple thermal management providers under one framework. Instead of backing a single technology, Sabey is positioning itself as a curator of proven, ready‑to‑integrate cooling options that map to varying density targets and sustainability goals. For IT and facilities teams under pressure to scale GPU‑rich deployments, that structure promises clearer design patterns and faster time to production.

Executives at both companies frame the partnership as a response to converging pressures: soaring compute demand, tightening efficiency requirements and growing scrutiny of data center energy use. Direct‑to‑chip liquid cooling has emerged as one of the more practical levers for improving thermal performance at the rack level, particularly in environments where power and floor space are limited but performance expectations are not.

For Sabey, formalizing JetCool’s technology as a standard, warranty‑backed option is part of a broader message to customers: liquid cooling is no longer a niche or one‑off feature, but an embedded part of the company’s roadmap for AI‑era infrastructure. Organizations evaluating their own cooling strategies can find the full announcement here.

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