In a strategic move underscoring the shift toward modular infrastructure, Compu Dynamics Modular (CDM), a Chantilly, Virginia-based specialist in prefabricated data center solutions, has acquired a majority stake in R&D Specialties, an Odessa, Texas, manufacturer of UL-certified control panels and modular electrical systems. Announced today, the deal expands CDM’s manufacturing footprint to 120,000 square feet, with room for growth on a 15-acre campus, positioning the company to meet skyrocketing demand for AI-ready, high-density deployments from hyperscalers, colocation providers, and enterprises.

This acquisition arrives at a pivotal moment. AI and high-performance computing (HPC) workloads demand unprecedented speed, density, and scalability – challenges traditional builds struggle to match. Modular solutions, once niche, are now the default for rapid, repeatable deployments.

“Modular infrastructure is where efficiency meets innovation,” said Ron Mann, vice president of CDM. “For decades, we’ve delivered solutions that solve real engineering challenges in high-stakes environments. Joining forces with R&D Specialties allows us to bring that expertise to the next generation of AI data centers at scale.”

Steve Altizer, president and CEO of Compu Dynamics, emphasized the market imperative: “This investment is about building the capabilities and capacity the market is demanding right now. AI infrastructure requires a different approach; one that delivers faster, scales smarter, and performs better. R&D Specialties brings the engineering depth and manufacturing precision that align perfectly with where this industry is headed.”

R&D Specialties, founded in 1983, excels in custom-engineered systems for mission-critical settings, complementing CDM’s vendor-neutral, end-to-end services – from design and liquid-cooled IT platforms to commissioning and maintenance. Brad Howell, president of R&D Specialties, noted the synergy: “Through joining forces with CDM, our growth opportunities for the combined teams have expanded even further. Being part of the AI infrastructure revolution and building what’s next is exciting.”

For data center operators, this signals broader ecosystem maturation. CDM’s turnkey modules accelerate time to market while integrating high-density power, low-latency networking, and sustainability features. With an extensive North American partner network, the combined entity can deploy campus-scale solutions anywhere, anytime – critical as AI power needs strain grids and supply chains.

This deal exemplifies how strategic M&A is fueling modular dominance, helping the industry navigate AI’s compute explosion with agility and reliability. Learn more at cd-modular.com.

The post CDM Acquires Majority Stake in R&D Specialties to Power AI Modular Data Center Surge appeared first on Data Center POST.

Data Center POST had the opportunity to connect with Paul Quigley, President of Airsys Cooling Technologies, Inc., ahead of PTC’26. With more than 36 years of experience spanning HVAC contracting, distribution, and executive leadership in manufacturing, Quigley is widely recognized for his work in large-scale, high-demand cooling environments. His career includes co-designing one of the largest VRF projects in North America and leading complex cooling initiatives across the United States. Since joining Airsys in 2021, Quigley has focused on advancing precision and liquid-assisted cooling technologies to help data center operators address power constraints driven by AI, high-density compute, and rapid digital infrastructure growth. In the Q&A below, Quigley shares his perspective on the challenges facing the global digital infrastructure industry and how Airsys is helping operators turn cooling efficiency into usable compute power.

Data Center Post (DCP) Question: What does your company do?  

Paul Quigley (PQ) Answer: Airsys is an energy-focused cooling solutions company founded on a simple idea: power should serve computation, not be lost protecting it. Every system we build returns power back to the data center where it belongs. Our innovative, award-winning technologies give operators more usable power for compute, improving capacity, resilience, and overall profitability.

DCP Q: What problems does your company solve in the market?

PQ A: Airsys helps data centers recover power lost to cooling. As AI clusters push energy systems past their limits, operators are forced to choose between compute, capacity, and cost. Our cooling technologies solve that problem by returning power back to the data center, reducing stranded capacity, and giving operators more usable power for compute.

DCP Q: What are your company’s core products or services?

PQ A: We design and build the world’s most advanced cooling solutions for data centers, including:

• LiquidRack spray-cooling and liquid-assisted rack systems
• High-efficiency DX and chilled-water cooling systems
• Flooded-evaporator chillers (CritiCool-X)
• Indoor and outdoor precision cooling systems
• Edge, modular, and containerized data-center cooling
• Control systems, energy-optimization tools, and PCE/ROIP performance frameworks

DCP Q: What markets do you serve?

PQ A:

• Hyperscale and AI compute environments
• Colocation and enterprise data centers
• Modular and prefabricated data centers
• Edge and telecom infrastructure
• Education, industrial, government, and defense applications requiring mission-critical cooling

DCP Q: What challenges does the global digital infrastructure industry face today?

PQ A: The industry now operates in an environment of rapid compute expansion and structural power scarcity. Grid limitations, long construction timelines, inefficient legacy cooling, land constraints, and the explosive rise of AI workloads have created an energy bottleneck. Data centers no longer struggle with space… they struggle with power.

DCP Q: How is your company adapting to these challenges?

PQ A: Airsys has always shifted the conversation from cooling to energy stewardship. Every system we design focuses on reducing cooling overhead and returning power to computation. Our LiquidRack spray-cooling platform, low-lift CritiCool-X chillers, and high-efficiency DX systems enable operators to deploy more compute with less infrastructure. We’re also advancing new metrics – PCE and ROIP – to help operators quantify the financial value of returned power.

DCP Q: What are your company’s key differentiators?

PQ A:

• Energy-first design philosophy — our systems return power to compute
• Rapid delivery and global manufacturing — critical in today’s supply-strained market
• LiquidRack spray cooling — enabling high-density AI clusters without stranded power
• Flooded-evaporator chiller technology — high efficiency, low lift, faster deployment
• End-to-end portfolio — DX, chilled water, liquid-assisted cooling, modular systems
• Practical engineering — simple, reliable, maintainable designs
• PCE / ROIP frameworks — financial and operational tools that change how operators evaluate cooling impact

DCP Q: What can we expect to see/hear from your company in the future?  

PQ A: You will see a major expansion of our LiquidRack platform, new ultra-efficient chiller technologies, deeper integration of PCE/ROIP metrics, and broader support for modular and edge deployments. We are continuing to push innovation toward one goal: giving operators more usable power for compute.

DCP Q: What upcoming industry events will you be attending? 

PQ A: Events Airsys is considering for 2026:

PTC’26 Hawaii; Escape the Cold Aisle Phoenix; Advancing DC Construction West; DCD>Connect New York; Data Center World DC; World of Modular Las Vegas; NSPMA; 7×24 Exchange Spring Orlando; Data Center Nation Toronto; Datacloud USA Austin; AI Infra Summit Santa Clara; DCW Power Dallas; Yotta Las Vegas; 7×24 Exchange Fall San Antonio; PTC DC; DCD>Connect Virginia; DCAC Austin; Supercomputing; Gartner IOCS; NVIDIA GTC; OCP Global Summit.

DCP Q: Do you have any recent news you would like us to highlight?

PQ A: Yes, Airsys has expanded its high-density cooling portfolio with several major advancements:

• LiquidRack spray-cooling platform for AI clusters
• CritiCool-X flooded-evaporator chiller line
• PowerOne high-density cooling solutions supporting AI, HPC, and hyperscale growth
• New PCE and ROIP frameworks that help operators quantify power-to-compute efficiency and energy stewardship

More announcements are planned for early 2026 as Airsys continues to expand its advanced cooling portfolio for high-density compute environments

DCP Q: Is there anything else you would like our readers to know about your company and capabilities?

PQ A: Airsys is built on a simple idea: power should serve computation, not be lost protecting it. Our mission is to help operators turn cooling losses into compute gains and to make energy stewardship a competitive advantage in the AI era.

DCP Q: Where can our readers learn more about your company?  

PQ A: www.airsysnorthamerica.com

DCP Q: How can our readers contact your company? 

PQ A: www.airsysnorthamerica.com/contact

To learn more about PTC’26, please visit www.ptc.org/ptc26. The event takes place January 18-21, 2026 in Honolulu, HI.

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The post Power Should Serve Compute: Airsys’ Energy-First Approach to Data Center Cooling appeared first on Data Center POST.

Originally posted on Compu Dynamics.

Artificial intelligence is transforming how digital infrastructure is conceived, designed, and deployed. While the world’s largest cloud providers continue to build massive hyperscale campuses, a new layer of demand is emerging — AI training clusters, high-performance compute environments, and inference nodes that require speed, density, and adaptability more than sheer scale.

For these applications, modular design is playing a strategic role. It isn’t a replacement for traditional builds. It’s an evolutionary complement — enabling rapid, precise deployment wherever high-density compute is needed.

Purpose-Built for AI, Not the Cloud of Yesterday

Traditional colocation and hyperscale data center facilities were engineered for predictable, virtualized workloads. AI environments behave differently. They run hotter, denser, and evolve faster. Training clusters may exceed 200 kW per rack and require liquid-cooling integration from day one. Inference workloads demand proximity to the user to minimize latency.

Modular data center solutions provide a practical way to meet those demands. Prefabricated, fully engineered modules can be built in parallel with site work, tested in controlled conditions, and commissioned in days rather than months. Each enclosure can be tailored to its purpose — an AI training pod, an inference edge node, or a compact expansion of existing capacity.

To continue reading, please click here.

The post Strategic Evolution of Data Center Infrastructure for the Age of AI appeared first on Data Center POST.